Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6841026 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, William J. Rudik | 2005-01-11 |
| 6586352 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, William J. Rudik | 2003-07-01 |
| 6387830 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, William J. Rudik | 2002-05-14 |
| 6176985 | Laminated electroplating rack and connection system for optimized plating | Francis J. Downes, Jr., Raymond T. Galasco, Robert M. Japp | 2001-01-23 |
| 6136733 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, William J. Rudik | 2000-10-24 |