Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for metallizing through holes in thin film substrates, and resulting devices

Method for metallizing through holes in thin film substrates, and resulting devices

US Patent 5525369 · Granted Jun 11, 1996

Estimated economic value: $10,629,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for increasing uniformity in ion mill process2010
Circuitized substrate with internal stacked semiconductor chips, method of makin2010
Superconducting articles, and methods for forming and using same2010
Method of forming uniform features using photoresist2009
Direct cooling pallet assembly for temperature stability for deep ion mill etch 2009
Superconducting articles, and methods for forming and using same2008
Direct cooling pallet tray for temperature stability for deep ion mill etch proc2007
Hyperbga buildup laminate2007
Superconducting articles, and methods for forming and using same2007
Joined superconductive articles2006
Hyperbga buildup laminate2005
Stress reducing stiffener ring2004