| 5972053 |
Capacitor formed within printed circuit board |
John M. Lauffer, Issa S. Mahmoud |
1999-10-26 |
| 5745334 |
Capacitor formed within printed circuit board |
John M. Lauffer, Issa S. Mahmoud |
1998-04-28 |
| 5191174 |
High density circuit board and method of making same |
Chi-Shih Chang, Voya R. Markovich, Keith A. Snyder, John P. Wiley |
1993-03-02 |
| 5114518 |
Method of making multilayer circuit boards having conformal Insulating layers |
Donald J. Lazzarini, John A. Welsh, John P. Wiley |
1992-05-19 |
| 5053104 |
Method of plasma etching a substrate with a gaseous organohalide compound |
Suryadevara V. Babu, Allan R. Knoll, Walter E. Mlynko, John F. Rembetski, Kenneth D. Mack |
1991-10-01 |
| 4918574 |
Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities |
Donald J. Lazzarini, John A. Welsh, John P. Wiley |
1990-04-17 |
| 4868350 |
High performance circuit boards |
John P. Wiley |
1989-09-19 |
| 4810326 |
Interlaminate adhesion between polymeric materials and electrolytic copper surfaces |
Suryadevara V. Babu, Vu Q. Bui, John A. Welsh |
1989-03-07 |
| 4797178 |
Plasma etch enhancement with large mass inert gas |
Vu Q. Bui, Kevin K. Chan, Vicki J. Malueg |
1989-01-10 |
| 4735820 |
Removal of residual catalyst from a dielectric substrate |
Peter A. Agostino, Suryadevara V. Babu |
1988-04-05 |
| 4718972 |
Method of removing seed particles from circuit board substrate surface |
Suryadevara V. Babu, William F. Herrmann, Voya R. Markovich, Robert T. Wiley |
1988-01-12 |
| 4599134 |
Plasma etching with tracer |
Suryadevara V. Babu, John A. Welsh |
1986-07-08 |
