Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5191174 | High density circuit board and method of making same | Chi-Shih Chang, Joseph G. Hoffarth, Voya R. Markovich, Keith A. Snyder | 1993-03-02 |
| 5142775 | Bondable via | — | 1992-09-01 |
| 5114518 | Method of making multilayer circuit boards having conformal Insulating layers | Joseph G. Hoffarth, Donald J. Lazzarini, John A. Welsh | 1992-05-19 |
| 4918574 | Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities | Joseph G. Hoffarth, Donald J. Lazzarini, John A. Welsh | 1990-04-17 |
| 4916260 | Circuit member for use in multilayered printed circuit board assembly and method of making same | Cynthia J. Broaddus, John R. Jephson, Eugene M. Scales, Carl C. Sissenstein | 1990-04-10 |
| 4868350 | High performance circuit boards | Joseph G. Hoffarth | 1989-09-19 |
| 4864722 | Low dielectric printed circuit boards | Donald J. Lazzarini, Robert T. Wiley | 1989-09-12 |
| 4854038 | Modularized fabrication of high performance printed circuit boards | — | 1989-08-08 |