| 7353590 |
Method of forming printed circuit card |
Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more |
2008-04-08 |
| 6986198 |
Method of forming printed circuit card |
Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more |
2006-01-17 |
| 6750405 |
Two signal one power plane circuit board |
Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more |
2004-06-15 |
| 6524654 |
Method of controlling the spread of an adhesive on a circuitized organic substrate |
John J. Konrad, Konstantinos I. Papathomas |
2003-02-25 |
| 6488198 |
Wire bonding method and apparatus |
Douglas E. Chrzanowski, James Warren Wilson, Jeffrey Zimmerman |
2002-12-03 |
| 6453549 |
Method of filling plated through holes |
Anilkumar C. Bhatt, David E. Houser |
2002-09-24 |
| 6432182 |
Treatment solution for reducing adhesive resin bleed |
John J. Konrad, Konstantinos I. Papathomas |
2002-08-13 |
| 6274291 |
Method of reducing defects in I/C card and resulting card |
Ashwinkumar C. Bhatt, John Christopher Camp, Mary Beth Fletcher, Kenneth Lynn Potter |
2001-08-14 |
| 6204453 |
Two signal one power plane circuit board |
Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more |
2001-03-20 |
| 6201194 |
Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric |
John M. Lauffer, Roy H. Magnuson, Voya R. Markovich |
2001-03-13 |
| 6099959 |
Method of controlling the spread of an adhesive on a circuitized organic substrate |
John J. Konrad, Konstantinos I. Papathomas |
2000-08-08 |
| 6009620 |
Method of making a printed circuit board having filled holes |
Ashwinkumar C. Bhatt, Joseph Alphonse Kotylo, Kenneth S. Lyjak, Amarjit S. Rai |
2000-01-04 |
| 5114518 |
Method of making multilayer circuit boards having conformal Insulating layers |
Joseph G. Hoffarth, Donald J. Lazzarini, John P. Wiley |
1992-05-19 |
| 4971715 |
Phenolic-free stripping composition and use thereof |
Richard G. Armant, Edward Lee Arrington, Anilkumar C. Bhatt, Donald M. Egleton, Frederick M. Ortloff +1 more |
1990-11-20 |
| 4918574 |
Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities |
Joseph G. Hoffarth, Donald J. Lazzarini, John P. Wiley |
1990-04-17 |
| 4810326 |
Interlaminate adhesion between polymeric materials and electrolytic copper surfaces |
Suryadevara V. Babu, Vu Q. Bui, Joseph G. Hoffarth |
1989-03-07 |
| 4618477 |
Uniform plasma for drill smear removal reactor |
Suryadevara V. Babu, Ronald S. Horwath, Neng-Hsing Lu |
1986-10-21 |
| 4599134 |
Plasma etching with tracer |
Suryadevara V. Babu, Joseph G. Hoffarth |
1986-07-08 |
| 4431685 |
Decreasing plated metal defects |
Michael J. Canestaro, Donald G. McBride |
1984-02-14 |
