DC

Douglas E. Chrzanowski

IBM: 1 patents #44,794 of 70,183Top 65%
📍 Owego, NY: #123 of 203 inventorsTop 65%
🗺 New York: #67,335 of 115,490 inventorsTop 60%
Overall (All Time): #3,565,261 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6488198 Wire bonding method and apparatus John A. Welsh, James Warren Wilson, Jeffrey Zimmerman 2002-12-03