Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5874154 | Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern | Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich +4 more | 1999-02-23 |
| 5854093 | Direct attachment of silicon chip to circuit carrier | — | 1998-12-29 |
| 5807766 | Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process | — | 1998-09-15 |
| 5800858 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich +4 more | 1998-09-01 |
| 5709906 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich +4 more | 1998-01-20 |
| 5427627 | Method for treating substrates | Michael J. Canestaro, Louis J. Konrad, III, Ronald J. Moore | 1995-06-27 |
| 5374454 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich +4 more | 1994-12-20 |
| 5294259 | Fluid treatment device | Michael J. Canestaro, Louis J. Konrad, III, Ronald J. Moore | 1994-03-15 |
| 5109601 | Method of marking a thin film package | — | 1992-05-05 |
| 4987100 | Flexible carrier for an electronic device | Theron L. Ellis | 1991-01-22 |
| 4965700 | Thin film package for mixed bonding of chips | — | 1990-10-23 |
| 4937707 | Flexible carrier for an electronic device | Theron L. Ellis | 1990-06-26 |
| 4908689 | Organic solder barrier | Jane M. Shaw | 1990-03-13 |
| 4855867 | Full panel electronic packaging structure | Charles E. Gazdik, Donald P. Seraphim, Patrick A. Toole | 1989-08-08 |
| 4766670 | Full panel electronic packaging structure and method of making same | Charles E. Gazdik, Donald P. Seraphim, Patrick A. Toole | 1988-08-30 |
| 4707378 | Method and apparatus for controlling the organic contamination level in an electroless plating bath | Robert G. Rickert | 1987-11-17 |
| 4707377 | Copper plating | Robert J. Capwell, Ronald A. Kaschak, Robert G. Rickert, Donald P. Seraphim | 1987-11-17 |
| 4692346 | Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath | Robert G. Rickert | 1987-09-08 |
| 4681654 | Flexible film semiconductor chip carrier | Robert J. Clementi, Charles E. Gazdik, William Lafer, Roy L. Lovesky, Joel V. Munson +1 more | 1987-07-21 |
| 4652345 | Method of depositing a metal from an electroless plating solution | Robert G. Rickert | 1987-03-24 |
| 4639380 | Process for preparing a substrate for subsequent electroless deposition of a metal | William J. Amelio, David W. Hume, Robert G. Rickert | 1987-01-27 |
| 4554184 | Method for plating from an electroless plating bath | Michael J. Canestaro, Ronald A. Kaschak, Donald P. Seraphim | 1985-11-19 |
| 4517051 | Multi-layer flexible film module | Charles E. Gazdik | 1985-05-14 |
| 4480288 | Multi-layer flexible film module | Charles E. Gazdik | 1984-10-30 |
| 4431685 | Decreasing plated metal defects | Michael J. Canestaro, John A. Welsh | 1984-02-14 |