Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 4810326 | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces | Suryadevara V. Babu, Joseph G. Hoffarth, John A. Welsh | 1989-03-07 | $10,355,000 |
| 4797178 | Plasma etch enhancement with large mass inert gas | Kevin K. Chan, Joseph G. Hoffarth, Vicki J. Malueg | 1989-01-10 | $39,782,000 |