Assignee
Inventors
- Suryadevara V. Babu (31 patents)
- Vu Q. Bui (2 patents)
- Joseph G. Hoffarth (12 patents)
- John A. Welsh (19 patents)
{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Interlaminate adhesion between polymeric materials and electrolytic copper surfaces", "item": "https://www.patentleaderboard.com/patent/4810326"}]}
Skip to contentUS Patent 4810326 · Granted Mar 7, 1989