Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6194024 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 2001-02-27 |
| 6134772 | Via fill compositions for direct attach of devices and methods of applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 2000-10-24 |
| 6030693 | Method for producing multi-layer circuit board and resulting article of manufacture | Christina M. Boyko, John M. Lauffer, Ronnie Charles McHatton | 2000-02-29 |
| 5972053 | Capacitor formed within printed circuit board | Joseph G. Hoffarth, John M. Lauffer | 1999-10-26 |
| 5830374 | Method for producing multi-layer circuit board and resulting article of manufacture | Christina M. Boyko, John M. Lauffer, Ronnie Charles McHatton | 1998-11-03 |
| 5766670 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 1998-06-16 |
| 5745334 | Capacitor formed within printed circuit board | Joseph G. Hoffarth, John M. Lauffer | 1998-04-28 |
| 5615827 | Flux composition and corresponding soldering method | Roy Lynn Arldt, Susan H. Downey, Harry J. Golden, Clement A. Okoro, James Spalik | 1997-04-01 |
| 5571593 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 1996-11-05 |
| 5531838 | Flux composition and corresponding soldering method | Roy Lynn Arldt, Susan H. Downey, Harry J. Goldlen, Clement A. Okoro, James Spalik | 1996-07-02 |
| 5286417 | Method and composition for making mechanical and electrical contact | Julian Partridge | 1994-02-15 |
| 5214250 | Method of reworking circuit panels, and circuit panels reworked thereby | Burtran Joe Cayson, John A. Covert, Steven A. Duncan, John M. Lauffer, Richard A. Schumacher | 1993-05-25 |
| 5197655 | Fine pitch solder application | Arthur L. Leerssen, Everitt W. Mace, Charles T. Randolph, John Duclos Reece, II, Gaston G. Settle +2 more | 1993-03-30 |
| 4990224 | Copper plating bath and process for difficult to plate metals | — | 1991-02-05 |
| 4956022 | Chemical polishing of aluminum alloys | — | 1990-09-11 |
| 4954370 | Electroless plating of nickel on anodized aluminum | — | 1990-09-04 |
| 4954226 | Additive plating bath and process | — | 1990-09-04 |
| 4898651 | Anodic coatings on aluminum for circuit packaging | — | 1990-02-06 |
| 4894126 | Anodic coatings on aluminum for circuit packaging | — | 1990-01-16 |
| 4750262 | Method of fabricating a printed circuitry substrate | Gustav Schrottke | 1988-06-14 |
| 4636251 | Materials for electrical contact | — | 1987-01-13 |
| 4431707 | Plating anodized aluminum substrates | Richard W. Burns | 1984-02-14 |