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Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module |
Kenneth E. Beilstein, Jr., Claude L. Bertin, Dennis Charles Dubois, Wayne J. Howell, Gordon A. Kelley, Jr. +4 more |
1999-07-13 |
| 5686843 |
Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module |
Kenneth E. Beilstein, Jr., Claude L. Bertin, Dennis Charles Dubois, Wayne J. Howell, Gordon A. Kelley, Jr. +4 more |
1997-11-11 |
| 5391917 |
Multiprocessor module packaging |
Richard J. Gilmour |
1995-02-21 |
| 5252857 |
Stacked DCA memory chips |
Milburn H. Kane, John G Roby |
1993-10-12 |
| 5239448 |
Formulation of multichip modules |
Charles T. Perkins |
1993-08-24 |
| 5198965 |
Free form packaging of specific functions within a computer system |
Stephen A. Curtis, Ronald W. Gedney |
1993-03-30 |
| 5007163 |
Non-destructure method of performing electrical burn-in testing of semiconductor chips |
Keith R. Pope |
1991-04-16 |
| 4967950 |
Soldering method |
Stephen P. Legg |
1990-11-06 |
| 4750262 |
Method of fabricating a printed circuitry substrate |
Issa S. Mahmoud |
1988-06-14 |
