| 6194024 |
Via fill compositions for direct attach of devices and methods for applying same |
Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more |
2001-02-27 |
| 6134772 |
Via fill compositions for direct attach of devices and methods of applying same |
Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more |
2000-10-24 |
| 5766670 |
Via fill compositions for direct attach of devices and methods for applying same |
Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more |
1998-06-16 |
| 5615827 |
Flux composition and corresponding soldering method |
Susan H. Downey, Harry J. Golden, Issa S. Mahmoud, Clement A. Okoro, James Spalik |
1997-04-01 |
| 5571593 |
Via fill compositions for direct attach of devices and methods for applying same |
Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more |
1996-11-05 |
| 5531838 |
Flux composition and corresponding soldering method |
Susan H. Downey, Harry J. Goldlen, Issa S. Mahmoud, Clement A. Okoro, James Spalik |
1996-07-02 |
