| 6194024 |
Via fill compositions for direct attach of devices and methods for applying same |
Roy Lynn Arldt, Christina M. Boyko, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more |
2001-02-27 |
| 6134772 |
Via fill compositions for direct attach of devices and methods of applying same |
Roy Lynn Arldt, Christina M. Boyko, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more |
2000-10-24 |
| 5766670 |
Via fill compositions for direct attach of devices and methods for applying same |
Roy Lynn Arldt, Christina M. Boyko, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more |
1998-06-16 |
| 5571593 |
Via fill compositions for direct attach of devices and methods for applying same |
Roy Lynn Arldt, Christina M. Boyko, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more |
1996-11-05 |
| 5214250 |
Method of reworking circuit panels, and circuit panels reworked thereby |
John A. Covert, Steven A. Duncan, John M. Lauffer, Issa S. Mahmoud, Richard A. Schumacher |
1993-05-25 |
