Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5724727 | Method of forming electronic component | Mona A. Chopra, Brian David Young | 1998-03-10 |
| 5708300 | Semiconductor device having contoured package body profile | Alan H. Woosley | 1998-01-13 |
| 5656549 | Method of packaging a semiconductor device | Alan H. Woosley, Harold Downey | 1997-08-12 |
| 5583376 | High performance semiconductor device with resin substrate and method for making the same | Janet Sickler | 1996-12-10 |
| 5197655 | Fine pitch solder application | Arthur L. Leerssen, Issa S. Mahmoud, Charles T. Randolph, John Duclos Reece, II, Gaston G. Settle +2 more | 1993-03-30 |
| 5004508 | Thermally dissipated soldering flux | Janet Sickler, Varadarajan Srinivasan | 1991-04-02 |