Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810893 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, Bing Dang, John U. Knickerbocker, Mario J. Interrante | 2023-11-07 |
| 11049841 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, Bing Dang, Mario J. Interrante, John U. Knickerbocker | 2021-06-29 |
| 10750615 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2020-08-18 |
| 10368441 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2019-07-30 |
| 10014273 | Fixture to constrain laminate and method of assembly | Thomas E. Lombardi, Donald A. Merte, Gregg B. Monjeau, David L. Questad | 2018-07-03 |
| 9974179 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2018-05-15 |
| 9627784 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2017-04-18 |
| 9455234 | Fixture to constrain laminate and method of assembly | Thomas E. Lombardi, Donald A. Merte, Gregg B. Monjeau, David L. Questad | 2016-09-27 |
| 8759151 | Fixture to constrain laminate and method of assembly | Thomas E. Lombardi, Donald A. Merte, Gregg B. Monjeau, David L. Questad | 2014-06-24 |
| 8188597 | Fixture to constrain laminate and method of assembly | Thomas E. Lombardi, Donald A. Merte, Gregg B. Monjeau, David L. Questad | 2012-05-29 |
| 7408264 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Pierre Langevin, Michael B. Vincent | 2008-08-05 |
| 7119003 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson +3 more | 2006-10-10 |
| 7109592 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Pierre Langevin, Michael B. Vincent | 2006-09-19 |
| 7067916 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson +3 more | 2006-06-27 |
| 6777817 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Michael A. Gaynes, Nancy C. LaBianca, Stefano S. Oggioni | 2004-08-17 |
| 6739497 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Pierre Langevin, Michael B. Vincent | 2004-05-25 |
| 6713858 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Luis J. Matienzo | 2004-03-30 |
| 6617698 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Michael A. Gaynes, Nancy C. LaBianca, Stefano S. Oggioni | 2003-09-09 |
| 6596559 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Luis J. Matienzo | 2003-07-22 |
| 6558981 | Method for making an encapsulated semiconductor chip module | Miguel A. Jimarez, Marybeth Perrino, Tien Y. Wu | 2003-05-06 |
| 6348738 | Flip chip assembly | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2002-02-19 |
| 6306683 | Method of forming a flip chip assembly, and a flip chip assembly formed by the method | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2001-10-23 |
| 6248614 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Luis J. Matienzo | 2001-06-19 |
| 6246124 | Encapsulated chip module and method of making same | Miguel A. Jimarez, Marybeth Perrino, Tien Y. Wu | 2001-06-12 |
| 6100114 | Encapsulation of solder bumps and solder connections | Cynthia S. Milkovich, Mark V. Pierson | 2000-08-08 |