| 8785217 |
Tunable radiation source |
Michael A. Gaynes, Michael S. Gordon, Kenneth P. Rodbell |
2014-07-22 |
| 8288177 |
SER testing for an IC chip using hot underfill |
Michael A. Gaynes, Michael S. Gordon, Kenneth F. Latzko, Aparna Prabhakar |
2012-10-16 |
| 8241957 |
Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more |
2012-08-14 |
| 7951648 |
Chip-level underfill method of manufacture |
Claudius Feger |
2011-05-31 |
| 7883919 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging |
Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more |
2011-02-08 |
| 7776993 |
Underfilling with acid-cleavable acetal and ketal epoxy oligomers |
Stephen L. Buchwalter, Claudius Feger, Gareth G. Hougham, Hosadurga Shobha |
2010-08-17 |
| 7773220 |
Method and system for collecting alignment data from coated chips or wafers |
Claudius Feger, Steven E. Steen |
2010-08-10 |
| 7649257 |
Discrete placement of radiation sources on integrated circuit devices |
Michael S. Gordon, Kenneth P. Rodbell |
2010-01-19 |
| 7556979 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more |
2009-07-07 |
| 7417315 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more |
2008-08-26 |
| 7238547 |
Packaging integrated circuits for accelerated detection of transient particle induced soft error rates |
Theodore H. Zabel, Michael A. Gaynes, Michael S. Gordon, Jerry D. Ackaret |
2007-07-03 |
| 7219713 |
Heterogeneous thermal interface for cooling |
Jeffrey D. Gelorme, Supratik Guha, Yves Martin, Theodore G. van Kessel |
2007-05-22 |
| 7063127 |
Method and apparatus for chip-cooling |
Jeffrey D. Gelorme, Hendrik F. Hamann, Yves Martin, Theodore G. van Kessel |
2006-06-20 |
| 6924171 |
Bilayer wafer-level underfill |
Stephen L. Buchwalter, David Danovitch, Fuad E. Doany, Claudius Feger, Peter A. Gruber +1 more |
2005-08-02 |
| 6919420 |
Acid-cleavable acetal and ketal based epoxy oligomers |
Stephen L. Buchwalter, Claudius Feger, Gareth G. Hougham, Hosadurga Shobha |
2005-07-19 |
| 6777817 |
Reworkable and thermally conductive adhesive and use thereof |
Stephen L. Buchwalter, Michael A. Gaynes, Stefano S. Oggioni, Son K. Tran |
2004-08-17 |
| 6617698 |
Reworkable and thermally conductive adhesive and use thereof |
Stephen L. Buchwalter, Michael A. Gaynes, Stefano S. Oggioni, Son K. Tran |
2003-09-09 |
| 6013414 |
Photosensitive polyimide-precursor formulation |
Jeffrey D. Gelorme, Martin J. Goldberg, Jane M. Shaw |
2000-01-11 |
| 6010832 |
Photosensitive polyimide-precursor formulation |
Jeffrey D. Gelorme, Martin J. Goldberg, Jane M. Shaw |
2000-01-04 |
| 5879859 |
Strippable photoimageable compositions |
Stephen L. Buchwalter, Jeffrey D. Gelorme, Jame M. Shaw |
1999-03-09 |
| 5858943 |
Gel for localized removal of reworkable encapsulant |
Stephen L. Buchwalter, Jeffrey D. Gelorme |
1999-01-12 |
| 5859655 |
Photoresist for use in ink jet printers and other micro-machining applications |
Jeffrey D. Gelorme |
1999-01-12 |
| 5780199 |
Polyamic acid and polyimide from fluorinated reactant |
Marie Angelopoulos, Jeffrey D. Gelorme, Jeffrey W. Labadie, David Lewis, Sally A. Swanson |
1998-07-14 |
| 5464927 |
Polyamic acid and polyimide from fluorinated reactant |
Marie Angelopoulos, Jeffrey D. Gelorme, Jeffrey W. Labadie, David Lewis, Sally A. Swanson |
1995-11-07 |
| 4806455 |
Thermal stabilization of photoresist images |
— |
1989-02-21 |