Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8785217 | Tunable radiation source | Michael A. Gaynes, Michael S. Gordon, Kenneth P. Rodbell | 2014-07-22 |
| 8288177 | SER testing for an IC chip using hot underfill | Michael A. Gaynes, Michael S. Gordon, Kenneth F. Latzko, Aparna Prabhakar | 2012-10-16 |
| 8241957 | Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2012-08-14 |
| 7951648 | Chip-level underfill method of manufacture | Claudius Feger | 2011-05-31 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2011-02-08 |
| 7776993 | Underfilling with acid-cleavable acetal and ketal epoxy oligomers | Stephen L. Buchwalter, Claudius Feger, Gareth G. Hougham, Hosadurga Shobha | 2010-08-17 |
| 7773220 | Method and system for collecting alignment data from coated chips or wafers | Claudius Feger, Steven E. Steen | 2010-08-10 |
| 7649257 | Discrete placement of radiation sources on integrated circuit devices | Michael S. Gordon, Kenneth P. Rodbell | 2010-01-19 |
| 7556979 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2009-07-07 |
| 7417315 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2008-08-26 |
| 7238547 | Packaging integrated circuits for accelerated detection of transient particle induced soft error rates | Theodore H. Zabel, Michael A. Gaynes, Michael S. Gordon, Jerry D. Ackaret | 2007-07-03 |
| 7219713 | Heterogeneous thermal interface for cooling | Jeffrey D. Gelorme, Supratik Guha, Yves Martin, Theodore G. van Kessel | 2007-05-22 |
| 7063127 | Method and apparatus for chip-cooling | Jeffrey D. Gelorme, Hendrik F. Hamann, Yves Martin, Theodore G. van Kessel | 2006-06-20 |
| 6924171 | Bilayer wafer-level underfill | Stephen L. Buchwalter, David Danovitch, Fuad E. Doany, Claudius Feger, Peter A. Gruber +1 more | 2005-08-02 |
| 6919420 | Acid-cleavable acetal and ketal based epoxy oligomers | Stephen L. Buchwalter, Claudius Feger, Gareth G. Hougham, Hosadurga Shobha | 2005-07-19 |
| 6777817 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Michael A. Gaynes, Stefano S. Oggioni, Son K. Tran | 2004-08-17 |
| 6617698 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Michael A. Gaynes, Stefano S. Oggioni, Son K. Tran | 2003-09-09 |
| 6013414 | Photosensitive polyimide-precursor formulation | Jeffrey D. Gelorme, Martin J. Goldberg, Jane M. Shaw | 2000-01-11 |
| 6010832 | Photosensitive polyimide-precursor formulation | Jeffrey D. Gelorme, Martin J. Goldberg, Jane M. Shaw | 2000-01-04 |
| 5879859 | Strippable photoimageable compositions | Stephen L. Buchwalter, Jeffrey D. Gelorme, Jame M. Shaw | 1999-03-09 |
| 5858943 | Gel for localized removal of reworkable encapsulant | Stephen L. Buchwalter, Jeffrey D. Gelorme | 1999-01-12 |
| 5859655 | Photoresist for use in ink jet printers and other micro-machining applications | Jeffrey D. Gelorme | 1999-01-12 |
| 5780199 | Polyamic acid and polyimide from fluorinated reactant | Marie Angelopoulos, Jeffrey D. Gelorme, Jeffrey W. Labadie, David Lewis, Sally A. Swanson | 1998-07-14 |
| 5464927 | Polyamic acid and polyimide from fluorinated reactant | Marie Angelopoulos, Jeffrey D. Gelorme, Jeffrey W. Labadie, David Lewis, Sally A. Swanson | 1995-11-07 |
| 4806455 | Thermal stabilization of photoresist images | — | 1989-02-21 |