NL

Nancy C. LaBianca

IBM: 24 patents #4,429 of 70,183Top 7%
MI Macdermid, Incorporated: 1 patents #44 of 99Top 45%
Overall (All Time): #164,857 of 4,157,543Top 4%
25
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8785217 Tunable radiation source Michael A. Gaynes, Michael S. Gordon, Kenneth P. Rodbell 2014-07-22
8288177 SER testing for an IC chip using hot underfill Michael A. Gaynes, Michael S. Gordon, Kenneth F. Latzko, Aparna Prabhakar 2012-10-16
8241957 Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more 2012-08-14
7951648 Chip-level underfill method of manufacture Claudius Feger 2011-05-31
7883919 Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more 2011-02-08
7776993 Underfilling with acid-cleavable acetal and ketal epoxy oligomers Stephen L. Buchwalter, Claudius Feger, Gareth G. Hougham, Hosadurga Shobha 2010-08-17
7773220 Method and system for collecting alignment data from coated chips or wafers Claudius Feger, Steven E. Steen 2010-08-10
7649257 Discrete placement of radiation sources on integrated circuit devices Michael S. Gordon, Kenneth P. Rodbell 2010-01-19
7556979 Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more 2009-07-07
7417315 Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more 2008-08-26
7238547 Packaging integrated circuits for accelerated detection of transient particle induced soft error rates Theodore H. Zabel, Michael A. Gaynes, Michael S. Gordon, Jerry D. Ackaret 2007-07-03
7219713 Heterogeneous thermal interface for cooling Jeffrey D. Gelorme, Supratik Guha, Yves Martin, Theodore G. van Kessel 2007-05-22
7063127 Method and apparatus for chip-cooling Jeffrey D. Gelorme, Hendrik F. Hamann, Yves Martin, Theodore G. van Kessel 2006-06-20
6924171 Bilayer wafer-level underfill Stephen L. Buchwalter, David Danovitch, Fuad E. Doany, Claudius Feger, Peter A. Gruber +1 more 2005-08-02
6919420 Acid-cleavable acetal and ketal based epoxy oligomers Stephen L. Buchwalter, Claudius Feger, Gareth G. Hougham, Hosadurga Shobha 2005-07-19
6777817 Reworkable and thermally conductive adhesive and use thereof Stephen L. Buchwalter, Michael A. Gaynes, Stefano S. Oggioni, Son K. Tran 2004-08-17
6617698 Reworkable and thermally conductive adhesive and use thereof Stephen L. Buchwalter, Michael A. Gaynes, Stefano S. Oggioni, Son K. Tran 2003-09-09
6013414 Photosensitive polyimide-precursor formulation Jeffrey D. Gelorme, Martin J. Goldberg, Jane M. Shaw 2000-01-11
6010832 Photosensitive polyimide-precursor formulation Jeffrey D. Gelorme, Martin J. Goldberg, Jane M. Shaw 2000-01-04
5879859 Strippable photoimageable compositions Stephen L. Buchwalter, Jeffrey D. Gelorme, Jame M. Shaw 1999-03-09
5858943 Gel for localized removal of reworkable encapsulant Stephen L. Buchwalter, Jeffrey D. Gelorme 1999-01-12
5859655 Photoresist for use in ink jet printers and other micro-machining applications Jeffrey D. Gelorme 1999-01-12
5780199 Polyamic acid and polyimide from fluorinated reactant Marie Angelopoulos, Jeffrey D. Gelorme, Jeffrey W. Labadie, David Lewis, Sally A. Swanson 1998-07-14
5464927 Polyamic acid and polyimide from fluorinated reactant Marie Angelopoulos, Jeffrey D. Gelorme, Jeffrey W. Labadie, David Lewis, Sally A. Swanson 1995-11-07
4806455 Thermal stabilization of photoresist images 1989-02-21