Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6639638 | LCD cover optical structure and method | Ramesh R. Kodnani, William J. Rudik, David B. Stone | 2003-10-28 |
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo | 2003-06-10 |
| 6569710 | Panel structure with plurality of chip compartments for providing high volume of chip modules | — | 2003-05-27 |
| 6559666 | Method and device for semiconductor testing using electrically conductive adhesives | William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Ajit K. Trivedi, Charles G. Woychik | 2003-05-06 |
| 6534848 | Electrical coupling of a stiffener to a chip carrier | Terry J. Dornbos, Raymond Phillips, William J. Rudik, David L. Thomas | 2003-03-18 |
| 6516513 | Method of making a CTE compensated chip interposer | Cynthia S. Milkovich, Charles G. Woychik | 2003-02-11 |
| 6517662 | Process for making semiconductor chip assembly | Thomas M. Culnane, Michael A. Gaynes, Ramesh R. Kodnani, Charles G. Woychik | 2003-02-11 |
| 6513701 | Method of making electrically conductive contacts on substrates | Donald I. Mead | 2003-02-04 |
| 6497943 | Surface metal balancing to reduce chip carrier flexing | Lisa J. Jimarez, Miguel A. Jimarez | 2002-12-24 |
| 6492071 | Wafer scale encapsulation for integrated flip chip and surface mount technology assembly | William E. Bernier, Ajit K. Trivedi | 2002-12-10 |
| 6492724 | Structure for reinforcing a semiconductor device to prevent cracking | Michael A. Gaynes, Aleksander Zubelewicz | 2002-12-10 |
| 6487461 | TFT panel alignment and attachment method and apparatus | Michael A. Gaynes, Allan O. Johnson, Ramesh R. Kodnani, Edward J. Tasillo | 2002-11-26 |
| 6437254 | Apparatus and method for printed circuit board repair | Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Amit K. Sarkhel, Ajit K. Trivedi | 2002-08-20 |
| 6429384 | Chip C4 assembly improvement using magnetic force and adhesive | Francis J. Downes, Jr., Robert M. Japp | 2002-08-06 |
| 6399892 | CTE compensated chip interposer | Cynthia S. Milkovich, Charles G. Woychik | 2002-06-04 |
| 6358627 | Rolling ball connector | Joseph A. Benenati, Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis +4 more | 2002-03-19 |
| 6344099 | TFT panel alignment and attachment method and apparatus | Michael A. Gaynes, Allan O. Johnson, Ramesh R. Kodnani, Edward J. Tasillo | 2002-02-05 |
| 6295724 | Apparatus for printed circuit board repair | Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Amit K. Sarkhel, Ajit K. Trivedi | 2001-10-02 |
| 6288559 | Semiconductor testing using electrically conductive adhesives | William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Ajit K. Trivedi, Charles G. Woychik | 2001-09-11 |
| 6268739 | Method and device for semiconductor testing using electrically conductive adhesives | William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Ajit K. Trivedi, Charles G. Woychik | 2001-07-31 |
| 6255208 | Selective wafer-level testing and burn-in | William E. Bernier, Claude L. Bertin, Anilkumar C. Bhatt, Michael A. Gaynes, Erik L. Hedberg +5 more | 2001-07-03 |
| 6252779 | Ball grid array via structure | Michael A. Gaynes | 2001-06-26 |
| 6225206 | Flip chip C4 extension structure and process | Miguel A. Jimarez, Cynthia S. Milkovich | 2001-05-01 |
| 6206997 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo | 2001-03-27 |
| 6197619 | Method for reinforcing a semiconductor device to prevent cracking | Michael A. Gaynes, Aleksander Zubelewicz | 2001-03-06 |