Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6204453 | Two signal one power plane circuit board | Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson +5 more | 2001-03-20 |
| 6204456 | Filling open through holes in a multilayer board | John M. Lauffer, Voya R. Markovich, Cheryl Palomaki | 2001-03-20 |
| 6195883 | Full additive process with filled plated through holes | Anilkumar C. Bhatt, Voya R. Markovich, Irving Memis | 2001-03-06 |
| 6175087 | Composite laminate circuit structure and method of forming the same | Ross W. Keesler, Voya R. Markovich, Jim P. Paoletti, Marybeth Perrino | 2001-01-16 |
| 6131279 | Integrated manufacturing packaging process | Gerald W. Jones, Ross W. Keesler, Voya R. Markovich, William J. Rudik, James Warren Wilson | 2000-10-17 |
| 6027858 | Process for tenting PTH's with PID dry film | Gerald W. Jones, Ross W. Keesler, Voya R. Markovich, Heinke Marcello, James Warren Wilson | 2000-02-22 |
| 5981880 | Electronic device packages having glass free non conductive layers | Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, John M. Lauffer, Voya R. Markovich +1 more | 1999-11-09 |
| 5922517 | Method of preparing a substrate surface for conformal plating | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Voya R. Markovich, Gerald W. Jones | 1999-07-13 |
| 5905018 | Method of preparing a substrate surface for conformal plating | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Voya R. Markovich, Gerald W. Jones | 1999-05-18 |
| 5427895 | Semi-subtractive circuitization | Roy H. Magnuson, Richard William Malek, Voya R. Markovich | 1995-06-27 |