Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7595454 | Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate | John S. Kresge | 2009-09-29 |
| 7508076 | Information handling system including a circuitized substrate having a dielectric layer without continuous fibers | Robert M. Japp, Voya R. Markovich, Kostas Papathomas, David L. Thomas | 2009-03-24 |
| 7416996 | Method of making circuitized substrate | Robert M. Japp, Voya R. Markovich, Kostas Papathomas, David L. Thomas | 2008-08-26 |
| 7078816 | Circuitized substrate | Robert M. Japp, Voya R. Markovich, Kostas Papathomas, David L. Thomas | 2006-07-18 |
| 6204456 | Filling open through holes in a multilayer board | John M. Lauffer, Voya R. Markovich, William E. Wilson | 2001-03-20 |