Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package including high density interposer and circuitized substrate assembly utilizing same

Electronic package including high density interposer and circuitized substrate assembly utilizing same

US Patent 8405229 · Granted Mar 26, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System for manufacturing of honeycomb extrusion dies and manufacturing methods t2025
Extrusion dies and methods of manufacturing the same2024
Method of preparing an electrode for use in forming a honeycomb extrusion die2023
Systems and methods for skinning articles2020
Method of making a circuitized substrate2017
Electrically conductive adhesive (ECA) for multilayer device interconnects2016
Coreless layer buildup structure with LGA and joining layer2016
Coreless layer buildup structure with LGA and joining layer2016
Coreless layer buildup structure with LGA and joining layer2016
Coreless layer buildup structure with LGA and joining layer2016
Conducting paste for device level interconnects2014
Substrate having internal capacitor and method of making same2013