Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923876 | Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof | Aleksandra Shepsis | 2021-02-16 |
| 10914535 | Integrated multi-chamber heat exchanger | Ryan M. Alderfer, Randall J. Stutzman | 2021-02-09 |
| 10816280 | Integrated multi-chamber heat exchanger | Ryan M. Alderfer, Matthew D. Miller | 2020-10-27 |
| 10548243 | Process for installing an insert for fluid-flow-through cooling of circuit boards | Brian Kaplun, James S. Eiche | 2020-01-28 |
| 10527362 | Integrated multi-chamber heat exchanger | Ryan M. Alderfer, Matthew D. Miller | 2020-01-07 |
| 10461018 | Integrated multi-chamber heat exchanger | Ryan M. Alderfer, Randall J. Stutzman | 2019-10-29 |
| 10371462 | Integrated multi-chamber heat exchanger | Ryan M. Alderfer, Randall J. Stutzman | 2019-08-06 |
| 10362713 | Process for making an apparatus with fluid-flow-through cooling of circuit boards | Brian Kaplun, James S. Eiche | 2019-07-23 |
| 9851161 | Heat exchanger construction using low temperature sinter techniques | Stephen J. Schober | 2017-12-26 |
| 9673514 | Dimensionally tolerant multiband conformal antenna arrays | Carl Baldwin, David R. Darling, Brian Kaplun, David R. Dorough | 2017-06-06 |
| 9510479 | Fluid-cooled module for integrated circuit devices | — | 2016-11-29 |
| 9426931 | Fluid-flow-through cooling of circuit boards | Brian Kaplun, James S. Eiche | 2016-08-23 |
| 9389103 | Sensor array packaging solution | James E. Bishop, Allan Johnson, Brian Kaplun, Steven E. McElwain, Jr. | 2016-07-12 |
| 8847823 | Dimensionally tolerant multiband conformal antenna arrays | Carl Baldwin, David R. Darling, Brian Kaplun, David R. Dorough | 2014-09-30 |
| 8730673 | Fluid-cooled module for integrated circuit devices | — | 2014-05-20 |
| 7995344 | High performance large tolerance heat sink | Charles H. Dando, III, Jon Larcheveque | 2011-08-09 |
| 7719108 | Enhanced reliability semiconductor package | William E. Murphy, Ryan Riegle, Richard Shields | 2010-05-18 |
| 7670877 | Reliability enhancement process | William E. Murphy, Ryan Riegle, Richard Shields | 2010-03-02 |
| 7324336 | Flow through cooling assemblies for conduction-cooled circuit modules | Randall J. Stutzman, Jon Larcheveque, Eugene J. Urda | 2008-01-29 |
| 7272468 | Self-sustaining environmental control unit | J. Claude Caci | 2007-09-18 |
| 7203574 | Self-sustaining environmental control unit | J. Claude Caci | 2007-04-10 |
| 6479931 | Extended temperature range fluorescent lamp | Gerhard Lange, Robert Joseph Komar | 2002-11-12 |
| 6330152 | Apparatus facilitating use of cots electronics in harsh environments | Ronald J. Feduke, Robert Jennings, Jan M. Nielsen | 2001-12-11 |
| 6151216 | Thermally conductive vibration isolators | Francis W. Hughto-Delzer | 2000-11-21 |
| 6002588 | Thermally conductive vibration isolators | Francis W. Hughto-Delzer | 1999-12-14 |