TD

Thomas W. Dalrymple

IBM: 2 patents #32,839 of 70,183Top 50%
📍 Endicott, NY: #278 of 620 inventorsTop 45%
🗺 New York: #48,759 of 115,490 inventorsTop 45%
Overall (All Time): #2,183,963 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6949415 Module with adhesively attached heat sink David J. Alcoe, Michael A. Gaynes, Randall J. Stutzman 2005-09-27
6744132 Module with adhesively attached heat sink David J. Alcoe, Michael A. Gaynes, Randall J. Stutzman 2004-06-01