Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6291776 | Thermal deformation management for chip carriers | Voya R. Markovich, Peter A. Moschak, Seungbae Park | 2001-09-18 |
| 6255136 | Method of making electronic package with compressible heatsink structure | David J. Alcoe | 2001-07-03 |
| 6256203 | Free standing, three dimensional, multi-chip, carrier package with air flow baffle | Anthony P. Ingraham, Glenn L. Kehley, John R. Slack | 2001-07-03 |
| 6245186 | Electronic package with compressible heatsink structure | David J. Alcoe | 2001-06-12 |
| 6219234 | Method for using pulsating flow to improve thermal transport in systems | Bahgat Sammakia | 2001-04-17 |
| 6075287 | Integrated, multi-chip, thermally conductive packaging device and methodology | Anthony P. Ingraham, Glenn L. Kehley, John R. Slack | 2000-06-13 |
| 6061245 | Free standing, three dimensional, multi-chip, carrier package with air flow baffle | Anthony P. Ingraham, Glenn L. Kehley, John R. Slack | 2000-05-09 |
| 6058015 | Electronic packages and a method to improve thermal performance of electronic packages | Bahgat Sammakia | 2000-05-02 |
| 6037658 | Electronic package with heat transfer means | William L. Brodsky, Glenn L. Kehley, John R. Slack | 2000-03-14 |
| 5966290 | Electronic packages and a method to improve thermal performance of electronic packages | Bahgat Sammakia | 1999-10-12 |
| 5926369 | Vertically integrated multi-chip circuit package with heat-sink support | Anthony P. Ingraham, Glenn L. Kehley, John R. Slack | 1999-07-20 |
| 5914857 | Air flow devices for electronic boards | Eric A. Johnson | 1999-06-22 |
| 5912800 | Electronic packages and method to enhance the passive thermal management of electronic packages | Bahgat Sammakia | 1999-06-15 |
| 5863814 | Electronic package with compressible heatsink structure | David J. Alcoe | 1999-01-26 |
| 5786635 | Electronic package with compressible heatsink structure | David J. Alcoe | 1998-07-28 |
| 5754400 | Demountable heat sink | Pratap Singh | 1998-05-19 |
| 5673177 | Heat sink structure with corrugated wound wire heat conductive elements | William L. Brodsky, Glenn L. Kehley | 1997-09-30 |
| 5654876 | Demountable heat sink | Pratap Singh | 1997-08-05 |
| 5604445 | Apparatus, and corresponding method, for stress testing semiconductor chips | Kishor Desai, Maganlal S. Patel | 1997-02-18 |
| 4977111 | Porous radiant burners having increased radiant output | Timothy W. Tong, Robert E. Peck | 1990-12-11 |