Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6256203 | Free standing, three dimensional, multi-chip, carrier package with air flow baffle | Anthony P. Ingraham, Glenn L. Kehley, Sanjeev Sathe | 2001-07-03 |
| 6075287 | Integrated, multi-chip, thermally conductive packaging device and methodology | Anthony P. Ingraham, Glenn L. Kehley, Sanjeev Sathe | 2000-06-13 |
| 6061245 | Free standing, three dimensional, multi-chip, carrier package with air flow baffle | Anthony P. Ingraham, Glenn L. Kehley, Sanjeev Sathe | 2000-05-09 |
| 6037658 | Electronic package with heat transfer means | William L. Brodsky, Glenn L. Kehley, Sanjeev Sathe | 2000-03-14 |
| 5926369 | Vertically integrated multi-chip circuit package with heat-sink support | Anthony P. Ingraham, Glenn L. Kehley, Sanjeev Sathe | 1999-07-20 |
| 5669775 | Assembly for mounting components to flexible cables | Jeffrey S. Campbell, James D. Herard, Ronald Peter Nowak, David B. Stone | 1997-09-23 |
| 4602733 | Desoldering apparatus and method | William Ditlef VON Voss | 1986-07-29 |