Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7672479 | Low maintenance flat mail line scan camera system | Gregory Reyner | 2010-03-02 |
| 7350690 | Method and apparatus for containing mail articles deposited in a mail drop box | Patrick J. Fitzgibbons, John Hoover, John Swider, Mary Wilcoxen | 2008-04-01 |
| 7175068 | Method and apparatus for containing mail articles deposited in a mail drop box | Patrick J. Fitzgibbons, John Hoover, John Swider, Mary Wilcoxen | 2007-02-13 |
| 6809330 | Automatic calibration and built-in diagnostic procedures for line scan cameras | Robert M. Krohn, James Howard, Steven J. Pratt | 2004-10-26 |
| 6534763 | Low maintenance line scan camera | Robert M. Krohn | 2003-03-18 |
| 6256203 | Free standing, three dimensional, multi-chip, carrier package with air flow baffle | Anthony P. Ingraham, Sanjeev Sathe, John R. Slack | 2001-07-03 |
| 6075287 | Integrated, multi-chip, thermally conductive packaging device and methodology | Anthony P. Ingraham, Sanjeev Sathe, John R. Slack | 2000-06-13 |
| 6061245 | Free standing, three dimensional, multi-chip, carrier package with air flow baffle | Anthony P. Ingraham, Sanjeev Sathe, John R. Slack | 2000-05-09 |
| 6037658 | Electronic package with heat transfer means | William L. Brodsky, Sanjeev Sathe, John R. Slack | 2000-03-14 |
| 5984691 | Flexible circuitized interposer with apertured member and method for making same | William L. Brodsky, Glenn E. Myrto, John H. Sherman | 1999-11-16 |
| 5938454 | Electrical connector assembly for connecting first and second circuitized substrates | William L. Brodsky, Glenn E. Myrto, John H. Sherman | 1999-08-17 |
| 5926369 | Vertically integrated multi-chip circuit package with heat-sink support | Anthony P. Ingraham, Sanjeev Sathe, John R. Slack | 1999-07-20 |
| 5919050 | Method and apparatus for separable interconnecting electronic components | Glenn E. Myrto, John H. Sherman | 1999-07-06 |
| 5759047 | Flexible circuitized interposer with apertured member and method for making same | William L. Brodsky, Glenn E. Myrto, John H. Sherman | 1998-06-02 |
| 5673177 | Heat sink structure with corrugated wound wire heat conductive elements | William L. Brodsky, Sanjeev Sathe | 1997-09-30 |