Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5604445 | Apparatus, and corresponding method, for stress testing semiconductor chips | Kishor Desai, Sanjeev Sathe | 1997-02-18 |
| 5263245 | Method of making an electronic package with enhanced heat sinking | John J. Zopff | 1993-11-23 |
| 5220487 | Electronic package with enhanced heat sinking | John J. Zopff | 1993-06-15 |
| 5137456 | High density, separable connector and contact for use therein | Kishor Desai, Thomas G. Macek, Edwin L. Thomas | 1992-08-11 |