Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally enhanced lid for multichip modules

Thermally enhanced lid for multichip modules

US Patent 7186590 · Granted Mar 6, 2007

Estimated economic value: $6,019,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Rotating lid for module cooler2024
Temporary removable module lid2023
Tamper-respondent assemblies with pressure connector assemblies2023
Hybrid cable assembly2023
On-demand testing for selected conditions2021
Tamper-respondent sensors with liquid crystal polymer layers2021
Acoustic attenuating ear muffs with mechanically actuated attenuation plugs2021
Enclosure with tamper respondent sensor2021
Hybrid cable assembly having shielded and unshielded portions2021
Integrated multi-chamber heat exchanger2021
Multi-directional motion monitoring of plugged electrical connector2021
Electronic attenuation adjusting hearing protection device2020