Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266598 | Dense via pitch interconnect to increase wiring density | Sungjun Chun, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi, Nam H. Pham +2 more | 2025-04-01 |
| 11388821 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Jean Audet | 2022-07-12 |
| 10956649 | Semiconductor package metal shadowing checks | Anson J. Call, Paul R. Walling | 2021-03-23 |
| 10660209 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Jean Audet | 2020-05-19 |
| 10423752 | Semiconductor package metal shadowing checks | Anson J. Call, Paul R. Walling | 2019-09-24 |
| 8722536 | Fabrication method for circuit substrate having post-fed die side power supply connections | Daniel Douriet, Brian L. Singletary, Lloyd A. Walls | 2014-05-13 |
| 8716851 | Continuously referencing signals over multiple layers in laminate packages | Lloyd A. Walls | 2014-05-06 |
| 8586476 | Fabrication method for circuit substrate having post-fed die side power supply connections | Daniel Douriet, Brian L. Singletary, Lloyd A. Walls | 2013-11-19 |
| 8158461 | Continuously referencing signals over multiple layers in laminate packages | Lloyd A. Walls | 2012-04-17 |
| 7863724 | Circuit substrate having post-fed die side power supply connections | Daniel Douriet, Brian L. Singletary, Lloyd A. Walls | 2011-01-04 |
| 7015574 | Electronic device carrier adapted for transmitting high frequency signals | David J. Alcoe, Ronald Peter Nowak, Stefano S. Oggioni | 2006-03-21 |