Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266598 | Dense via pitch interconnect to increase wiring density | Francesco Preda, Sungjun Chun, Jose A. Hejase, Junyan Tang, Nam H. Pham +2 more | 2025-04-01 |
| 11658378 | Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) | Joshua C. Myers, Jose A. Hejase, Junyan Tang, Wiren D. Becker, Sungjun Chun +1 more | 2023-05-23 |
| 11399428 | PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication | Jose A. Hejase, Junyan Tang, Joshua C. Myers, Sungjun Chun, Wiren D. Becker +1 more | 2022-07-26 |
| 11177665 | Redundant voltage delivery with active cables | Prasanna Jayaraman, Nam H. Pham, Daniel M. Dreps | 2021-11-16 |
| 11157274 | Architecture with micro-controller and high-speed active cables | Prasanna Jayaraman, Nam H. Pham, Daniel M. Dreps | 2021-10-26 |
| 10705134 | High speed chip substrate test fixture | Lloyd A. Walls, Nam H. Pham, Jason R. Eagle, Nathan Lee Dunfee | 2020-07-07 |