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2011-03-29 |
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Circuit substrate having post-fed die side power supply connections |
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Apparatus and method for selectively monitoring multiple voltages in an IC or other electronic chip |
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| 7467050 |
Method for detecting noise events in systems with time variable operating points |
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2008-12-16 |
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2008-12-02 |
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2008-05-20 |
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Method, apparatus, and computer program product for enhancing a power distribution system in a ceramic integrated circuit package |
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2007-09-25 |
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Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design |
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Method, structure, and computer program product for implementing high frequency return current paths within electronic packages |
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2006-01-31 |
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Microwave circuit packages having a reduced number of vias in the substrate |
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2002-07-30 |
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Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format |
— |
2001-04-10 |
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Multiple resonant frequency decoupling capacitor |
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1995-06-06 |
