Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10267264 | Monopropellant driven hydraulic pressure supply | Charles Don Coppedge, Joseph Reeves, Jayant Ramakrishnan | 2019-04-23 |
| 10066643 | Multiple gas generator driven pressure supply | Charles Don Coppedge, Joseph Reeves, Jayant Ramakrishnan | 2018-09-04 |
| 6426686 | Microwave circuit packages having a reduced number of vias in the substrate | Daniel Douriet, M. P. Ramachandra Panicker | 2002-07-30 |
| 5832598 | Method of making microwave circuit package | Norman L. Greenman, M. P. Ramachandra Panicker | 1998-11-10 |
| RE35733 | Device for interconnecting integrated circuit packages to circuit boards | Scott S. Simpson, Michael S. Hyslop | 1998-02-17 |
| 5707575 | Method for filling vias in ceramic substrates with composite metallic paste | David K. Litt | 1998-01-13 |
| RE35064 | Multilayer printed wiring board | — | 1995-10-17 |
| 5422782 | Multiple resonant frequency decoupling capacitor | Daniel Douriet | 1995-06-06 |
| 5272590 | Integrated circuit package having an internal cavity for incorporating decoupling capacitor | — | 1993-12-21 |
| 5095402 | Internally decoupled integrated circuit package | Michael S. Hyslop | 1992-03-10 |
| 5065284 | Multilayer printed wiring board | — | 1991-11-12 |
| 5065281 | Molded integrated circuit package incorporating heat sink | Scott S. Simpson | 1991-11-12 |
| 5051542 | Low impedance bus bar | — | 1991-09-24 |
| 5034850 | Thin decoupling capacitor for mounting under integrated circuit package | Andrew B. Feinberg | 1991-07-23 |
| 4994936 | Molded integrated circuit package incorporating decoupling capacitor | — | 1991-02-19 |
| 4989117 | Molded integrated circuit package incorporating thin decoupling capacitor | — | 1991-01-29 |
| 4908258 | High dielectric constant flexible sheet material | — | 1990-03-13 |
| 4873612 | Temperature stable multilayer capacitor | — | 1989-10-10 |
| 4853826 | Low inductance decoupling capacitor | — | 1989-08-01 |
| 4853827 | High dielectric multilayer capacitor | — | 1989-08-01 |
| 4754366 | Decoupling capacitor for leadless surface mounted chip carrier | — | 1988-06-28 |
| 4748537 | Decoupling capacitor and method of formation thereof | Rodney W. Larson | 1988-05-31 |
| 4734819 | Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package | Rodney W. Larson | 1988-03-29 |
| 4734818 | Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages | Aleta Gilderdale | 1988-03-29 |
| 4706162 | Multilayer capacitor elements | Aleta Gilderdale | 1987-11-10 |