Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6631078 | Electronic package with thermally conductive standoff | Varaprasad V. Calmidi, Krishna Darbha, Sanjeev Sathe | 2003-10-07 |
| 6583354 | Method of reforming reformable members of an electronic package and the resultant electronic package | — | 2003-06-24 |
| 6570259 | Apparatus to reduce thermal fatigue stress on flip chip solder connections | Eric A. Johnson, Matthew Reiss, Charles G. Woychik | 2003-05-27 |
| 6455924 | Stress-relieving heatsink structure and method of attachment to an electronic package | Randall J. Stutzman | 2002-09-24 |
| 6255136 | Method of making electronic package with compressible heatsink structure | Sanjeev Sathe | 2001-07-03 |
| 6245186 | Electronic package with compressible heatsink structure | Sanjeev Sathe | 2001-06-12 |
| 6060341 | Method of making an electronic package | Frank E. Andros | 2000-05-09 |
| 6051982 | Electronic component test apparatus with rotational probe and conductive spaced apart means | David V. Caletka | 2000-04-18 |
| 5947750 | Elastomeric structure with multi-layered elastomer and constraining base | William L. Brodsky, David V. Caletka | 1999-09-07 |
| 5877043 | Electronic package with strain relief means and method of making | Steven Anderson, Yifan Guo, Eric A. Johnson | 1999-03-02 |
| 5873740 | Electrical connector system with member having layers of different durometer elastomeric materials | William L. Brodsky, David V. Caletka | 1999-02-23 |
| 5863814 | Electronic package with compressible heatsink structure | Sanjeev Sathe | 1999-01-26 |
| 5804984 | Electronic component test apparatus with rotational probe | David V. Caletka | 1998-09-08 |
| 5786635 | Electronic package with compressible heatsink structure | Sanjeev Sathe | 1998-07-28 |
| 5760465 | Electronic package with strain relief means | Steven Anderson, Yifan Guo, Eric A. Johnson | 1998-06-02 |