Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8910853 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2014-12-16 |
| 8493746 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2013-07-23 |
| 8232636 | Reliability enhancement of metal thermal interface | James N. Humenik, Sushumna Iruvanti, Richard Langlois, Govindarajan Natarajan, Kamal K. Sikka +4 more | 2012-07-31 |
| 8156990 | Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers | Jay A. Bunt, Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr. +7 more | 2012-04-17 |
| 7947143 | Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers | Jay A. Bunt, Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr. +7 more | 2011-05-24 |
| 7836935 | Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers | Jay A. Bunt, Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr. +7 more | 2010-11-23 |
| 7683493 | Intermetallic diffusion block device and method of manufacture | Charles L. Arvin, Carla A. Bailey, Harry D. Cox, Hua Gan, Arthur G. Merryman +3 more | 2010-03-23 |
| 7472650 | Nickel alloy plated structure | Harry D. Cox, Nike Medahunsi, Krystyna W. Semkow | 2009-01-06 |
| 7369410 | Apparatuses for dissipating heat from semiconductor devices | Howard H. Chen, Louis L. Hsu, Lawrence S. Mok | 2008-05-06 |
| 7302757 | Micro-bumps to enhance LGA interconnections | Jeffrey A. Brody, Hai P. Longworth, James Monaco, Gerard Nuzback, Wei Zou | 2007-12-04 |
| 7287468 | Nickel alloy plated structure | Harry D. Cox, Nike Medahunsi, Krystyna W. Semkow | 2007-10-30 |
| 7078320 | Partial wafer bonding and dicing | Louis C. Hsu, James R. Salimeno, III | 2006-07-18 |
| 6838009 | Rework method for finishing metallurgy on chip carriers | Charles L. Arvin, Daniel G. Berger, Krystyna W. Semkow | 2005-01-04 |
| 6662718 | Screening mask having a stress-relieving area | Evelyn Barrington, Jeffrey A. Brody, Harry D. Cox, Lorraine Di Piero-Simmonds, John J. Garant +7 more | 2003-12-16 |
| 6348233 | Method of forming conductive line features for enhanced reliability of multi-layer ceramic substrates | Jeffrey A. Brody, Harry D. Cox, John J. Garant, Paul G. McLaughlin, Tom Wayson | 2002-02-19 |
| 6217989 | Conductive line features for enhanced reliability of multi-layer ceramic substrates | Jeffrey A. Brody, Harry D. Cox, John J. Garant, Paul G. McLaughlin, Tom Wayson | 2001-04-17 |
| 5985128 | Method of performing processes on features with electricity | Shaji Farooq, Suryanarayana Kaja, Karen P. McLaughlin, Gregg B. Monjeau, Kim H. Ruffing | 1999-11-16 |
| 5935404 | Method of performing processes on features with electricity | Shaji Farooq, Suryanarayana Kaja, Karen P. McLaughlin, Gregg B. Monjeau, Kim H. Ruffing | 1999-08-10 |