Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10571490 | Solder bump array probe tip structure for laser cleaning | David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell +2 more | 2020-02-25 |
| 9835653 | Solder bump array probe tip structure for laser cleaning | David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell +2 more | 2017-12-05 |
| 7230335 | Inspection methods and structures for visualizing and/or detecting specific chip structures | Jerome L. Cann, Steven J. Holmes, Leendert M. Huisman, Cherie R. Kagan, Leah Pastel +2 more | 2007-06-12 |
| 7078320 | Partial wafer bonding and dicing | Louis C. Hsu, Hsichang Liu | 2006-07-18 |