Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8587112 | Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack | Charles L. Arvin, David J. Russell, Krystyna W. Semkow | 2013-11-19 |
| 8367543 | Structure and method to improve current-carrying capabilities of C4 joints | Mukta G. Farooq, Jasvir Singh Jaspal, William Francis Landers, Thomas E. Lombardi, H. Bernhard Pogge +1 more | 2013-02-05 |
| 8232655 | Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack | Charles L. Arvin, David J. Russell, Krystyna W. Semkow | 2012-07-31 |
| 7302757 | Micro-bumps to enhance LGA interconnections | Jeffrey A. Brody, Hsichang Liu, James Monaco, Gerard Nuzback, Wei Zou | 2007-12-04 |
| 6391669 | Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices | Benjamin V. Fasano, Vincent P. Peterson, Anthony L. Plachy, Robert N. Wiggin | 2002-05-21 |