Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391669 | Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices | Benjamin V. Fasano, Hai P. Longworth, Vincent P. Peterson, Robert N. Wiggin | 2002-05-21 |
| 5471090 | Electronic structures having a joining geometry providing reduced capacitive loading | Alina Deutsch, David Lewis, Chandrasekhar Narayan | 1995-11-28 |