Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5961032 | Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold | James H. Covell, Peter A. Gruber, Sudipta K. Ray | 1999-10-05 |
| 5935404 | Method of performing processes on features with electricity | Suryanarayana Kaja, Hsichang Liu, Karen P. McLaughlin, Gregg B. Monjeau, Kim H. Ruffing | 1999-08-10 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Lester W. Herron, Hal Mitchell Lasky +6 more | 1999-07-20 |
| 5787578 | Method of selectively depositing a metallic layer on a ceramic substrate | Suryanarayana Kaja, John U. Knickerbocker, Brenda Peterson, Srinivasan N. Reddy, Rao V. Vallabhaneni +1 more | 1998-08-04 |
| 5723905 | Semiconductor package with low strain seal | Patrick A. Coico, David L. Edwards, Raed A. Sherif, Hilton T. Toy | 1998-03-03 |
| 5541005 | Large ceramic article and method of manufacturing | Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Irene S. Frantz, Katherine G. Frase +12 more | 1996-07-30 |
| 5532031 | I/O pad adhesion layer for a ceramic substrate | Sampath Purushothaman, Srinivasa S. N. Reddy, Vivek M. Sura | 1996-07-02 |
| 5525761 | Copper-based paste containing refractory metal additions for densification control | Lawrence D. David, Anthony Mastreani, Srinivasa S. N. Reddy, Rao V. Vallabhaneni | 1996-06-11 |
| 5512711 | Copper-based paste containing refractory metal additions for densification control | Lawrence D. David, Anthony Mastreani, Srinivasa S. N. Reddy, Rao V. Vallabhaneni | 1996-04-30 |
| 5439636 | Large ceramic articles and method of manufacturing | Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Irene S. Frantz, Katharine G. Frase +12 more | 1995-08-08 |
| 5337475 | Process for producing ceramic circuit structures having conductive vias | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Edward A. Giess, Young-Ho Kim +12 more | 1994-08-16 |
| 5284286 | Porous metal block for removing solder or braze from a substate and a process for making the same | Peter J. Brofman, Kathleen A. Lidestri, Gregg B. Monjeau, Karl J. Puttlitz | 1994-02-08 |
| 5283104 | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Edward A. Giess, Young-Ho Kim +12 more | 1994-02-01 |
| 5219520 | Process of making a porous metal block for removing solder or braze | Peter J. Brofman, Kathleen A. Lidestri, Gregg B. Monjeau, Karl J. Puttlitz | 1993-06-15 |
| 5073180 | Method for forming sealed co-fired glass ceramic structures | Govindarajan Natarajan, Srinivasa S. N. Reddy, Richard A. Shelleman, Nancy Cecelia Stoffel, Rao V. Vallabhaneni | 1991-12-17 |