Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424591 | Method and structure of forming independent contact for staggered CFET | Ruilong Xie, Albert M. Chu, Brent A. Anderson, Junli Wang, Ravikumar Ramachandran | 2025-09-23 |
| 12322652 | Local interconnect for cross coupling | Heng Wu, Ruilong Xie, Albert M. Chu, Junli Wang, Brent A. Anderson | 2025-06-03 |
| 12310072 | Middle of line structure with stacked devices | Junli Wang, Su Chen Fan, Ruqiang Bao | 2025-05-20 |
| 12278184 | Vertically-stacked field effect transistor cell | Albert M. Chu, Junli Wang, Dechao Guo | 2025-04-15 |
| 12268026 | High aspect ratio contact structure with multiple metal stacks | Junli Wang, Brent A. Anderson, Terence B. Hook, Indira Seshadri, Stuart A. Sieg +2 more | 2025-04-01 |
| 12268031 | Backside power rails and power distribution network for density scaling | Ruilong Xie, Kisik Choi, Somnath Ghosh, Sagarika Mukesh, Albert M. Chu +6 more | 2025-04-01 |
| 12142656 | Staggered stacked semiconductor devices | Albert M. Chu, Junli Wang, Vidhi Zalani, Dechao Guo | 2024-11-12 |
| 12136655 | Backside electrical contacts to buried power rails | Ruilong Xie, Brent A. Anderson, Kangguo Cheng, Julien Frougier, Balasubramanian Pranatharthiharan +2 more | 2024-11-05 |
| 11956939 | Static random access memory using vertical transport field effect transistors | Tsung-Sheng Kang, Ardasheir Rahman, Tao Li | 2024-04-09 |
| 11915966 | Backside power rail integration | Ruilong Xie, Takeshi Nogami, Roy R. Yu, Balasubramanian Pranatharthiharan, Kisik Choi +1 more | 2024-02-27 |
| 11710666 | Dummy fin template to form a self-aligned metal contact for output of vertical transport field effect transistor | Junli Wang, Brent A. Anderson | 2023-07-25 |
| 11678475 | Static random access memory using vertical transport field effect transistors | Tsung-Sheng Kang, Ardasheir Rahman, Tao Li | 2023-06-13 |
| 11145550 | Dummy fin template to form a self-aligned metal contact for output of vertical transport field effect transistor | Junli Wang, Brent A. Anderson | 2021-10-12 |
| 9887623 | Efficient voltage conversion | Leland Chang, Robert K. Montoye, Jae-sun Seo | 2018-02-06 |
| 9755506 | Efficient voltage conversion | Leland Chang, Robert K. Montoye, Jae-sun Seo | 2017-09-05 |
| 9005989 | Optoelectronic detection system | James D. Harper, Richard H. Mathews, Bernadette Johnson, Martha S. Petrovick, Ann Rundell +7 more | 2015-04-14 |
| 8962448 | Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2015-02-24 |
| 8828800 | Method of forming adaptive interconnect structure having programmable contacts | Leland Chang, Matthew R. Wordeman | 2014-09-09 |
| 8664081 | Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2014-03-04 |
| 8546188 | Bow-balanced 3D chip stacking | Fei Liu, Roy R. Yu | 2013-10-01 |
| 8492869 | 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2013-07-23 |
| 8399336 | Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2013-03-19 |
| 8298914 | 3D integrated circuit device fabrication using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2012-10-30 |
| 8174841 | Adaptive interconnect structure | Leland Chang, Matthew R. Wordeman | 2012-05-08 |
| 7999377 | Method and structure for optimizing yield of 3-D chip manufacture | Edward M. DeMulder, Sarah H. Knickerbocker, Michael J. Shapiro | 2011-08-16 |