Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919356 | Method and structure to reduce cracking in flip chip underfill | Mukta G. Farooq, Dae Young Jung, Ian D. Melville | 2011-04-05 |
| 7674690 | Inhibition of metal diffusion arising from laser dicing | Mukta G. Farooq, Da-young Jung | 2010-03-09 |
| 7566637 | Method of inhibition of metal diffusion arising from laser dicing | Mukta G. Farooq, Dae Young Jung | 2009-07-28 |
| 7375021 | Method and structure for eliminating aluminum terminal pad material in semiconductor devices | Daniel C. Edelstein, Mukta G. Farooq, Ian D. Melville | 2008-05-20 |
| 6670675 | Deep trench body SOI contacts with epitaxial layer formation | Herbert L. Ho, S. Sundar Kumar Iyer, Babar A. Khan | 2003-12-30 |
| 6486043 | Method of forming dislocation filter in merged SOI and non-SOI chips | Herbert L. Ho, Subramanian S. Iyer, S. Sundar Kumar Iyer | 2002-11-26 |
| 6353246 | Semiconductor device including dislocation in merged SOI/DRAM chips | Subramanian S. Iyer, Scott R. Stiffler, Kevin R. Winstel | 2002-03-05 |
| 6306528 | Method for the controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Lester W. Herron +4 more | 2001-10-23 |
| 6297127 | Self-aligned deep trench isolation to shallow trench isolation | Bomy Chen, Liang Han, Jay G. Harrington, Herbert L. Ho, Hsing-Jen Wann | 2001-10-02 |
| 6261876 | Planar mixed SOI-bulk substrate for microelectronic applications | Scott W. Crowder, Subramanian S. Iyer | 2001-07-17 |
| 6200373 | Method for controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Lester W. Herron +4 more | 2001-03-13 |
| 6200234 | Portable soccer golf game | — | 2001-03-13 |
| 6096580 | Low programming voltage anti-fuse | S. Sundar Kumar Iyer, Liang Han, Subramanian S. Iyer, Mukesh V. Khare | 2000-08-01 |
| 6004624 | Method for the controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Lester W. Herron +4 more | 1999-12-21 |
| 5932043 | Method for flat firing aluminum nitride/tungsten electronic modules | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Lester W. Herron +4 more | 1999-08-03 |
| 5904868 | Mounting and/or removing of components using optical fiber tools | Laertis Economikos, Charles J. Hendricks, Richard P. Surprenant | 1999-05-18 |
| 5763093 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Jonathan H. Harris +7 more | 1998-06-09 |
| 5742021 | High thermal conductivity substrate and the method of brazing a cap thereto | Laertis Economikos, Richard P. Surprenant, Thomas J. VanDuynhoven | 1998-04-21 |
| 5682589 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Jonathan H. Harris +7 more | 1997-10-28 |
| 5552107 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Jonathan H. Harris +7 more | 1996-09-03 |
| 5552232 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Jonathan H. Harris +7 more | 1996-09-03 |
| 5491319 | Laser ablation apparatus and method | Laertis Economikos, Richard P. Surprenant | 1996-02-13 |