Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7833897 | Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface | Sarah H. Knickerbocker, Sean A. Allen, John J. Garant, Phillip W. Palmatier, Christopher L. Tessler | 2010-11-16 |
| 7666780 | Alignment verification for C4NP solder transfer | Sarah H. Knickerbocker, Srinivasa S. N. Reddy | 2010-02-23 |
| 6892781 | Method and apparatus for application of pressure to a workpiece by thermal expansion | Dale Curtis McHerron, Kaushal S. Patel, Christopher L. Tessler, James Edward Tersigni | 2005-05-17 |