Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679775 | Selective dopant junction for a group III-V semiconductor device | Kevin K. Chan, Marinus Hopstaken, Young-Hee Kim, Masaharu Kobayashi, Effendi Leobandung +3 more | 2017-06-13 |
| 9589894 | Copper interconnect structure and its formation | Daniel C. Edelstein, Takeshi Nogami, Christopher C. Parks | 2017-03-07 |
| 9418846 | Selective dopant junction for a group III-V semiconductor device | Kevin K. Chan, Marinus Hopstaken, Young-Hee Kim, Masaharu Kobayashi, Effendi Leobandung +3 more | 2016-08-16 |
| 8969197 | Copper interconnect structure and its formation | Daniel C. Edelstein, Takeshi Nogami, Christopher C. Parks | 2015-03-03 |
| 7405153 | Method for direct electroplating of copper onto a non-copper plateable layer | Sandra G. Malhotra, Hariklia Deligianni, Stephen M. Rossnagel, Xiaoyan Shao, Oscar van der Straten | 2008-07-29 |
| 7223691 | Method of forming low resistance and reliable via in inter-level dielectric interconnect | Cyril Cabral, Jr., Lawrence A. Clevenger, Timothy J. Dalton, Patrick W. DeHaven, Chester T. Dziobkowski +4 more | 2007-05-29 |