Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Clamshell apparatus for electrochemically treating wafers

Clamshell apparatus for electrochemically treating wafers

US Patent 6800187 · Granted Oct 5, 2004

Estimated economic value: $10,886,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Byproduct removal from electroplating solutions2025
TSV process window and fill performance enhancement by long pulsing and ramping2025
Gold through silicon mask plating2025
Wafer shielding for prevention of lipseal plate-out2025
Systems and methods for utilizing intrinsic current noise to measure interface i2024
Copper electrofill on non-copper liner layers2024
Electromagnetic interference reduction in extended reality environments2024
Electro-oxidative metal removal in through mask interconnect fabrication2023
Electroplating apparatus for tailored uniformity profile2023
Cleaning electroplating substrate holders using reverse current deplating2023
Removal of electroplating bath additives2022
Monitoring surface oxide on seed layers during electroplating2021