Issued Patents All Time
Showing 26–50 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385035 | Current ramping and current pulsing entry of substrates for electroplating | Tighe A. Spurlin, Jian Zhou, Edward C. Opocensky, Steven T. Mayer | 2016-07-05 |
| 9309604 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Zhian He, Seshasayee Varadarajan | 2016-04-12 |
| 9109295 | Electrolyte concentration control system for high rate electroplating | Seshasayee Varadarajan, Steven T. Mayer | 2015-08-18 |
| 9045840 | Dynamic current distribution control apparatus and method for wafer electroplating | David W. Porter, Frederick Dean Wilmot | 2015-06-02 |
| 9045841 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, John Sukamto, Zhian He, Seshasayee Varadarajan, Steven T. Mayer | 2015-06-02 |
| 8722539 | Process for through silicon via filling | Katie Qun Wang, Mark J. Willey | 2014-05-13 |
| 8709948 | Tungsten barrier and seed for copper filled TSV | Michal Danek, Tom Mountsier, Juwen Gao, Aaron R. Fellis | 2014-04-29 |
| 8703615 | Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers | Thomas A. Ponnuswamy, John Sukamto, Steven T. Mayer, Huanfeng Zhu | 2014-04-22 |
| 8623193 | Method of electroplating using a high resistance ionic current source | Steven T. Mayer | 2014-01-07 |
| 8575028 | Method and apparatus for filling interconnect structures | Huanfeng Zhu | 2013-11-05 |
| 8513124 | Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers | Thomas A. Ponnuswamy, John Sukamto, Steven T. Mayer | 2013-08-20 |
| 8475636 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Zhian He, Seshasayee Varadarajan | 2013-07-02 |
| 8475644 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Zhian He, Seshasayee Varadarajan | 2013-07-02 |
| 8415261 | Capping before barrier-removal IC fabrication method | Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2013-04-09 |
| 8377824 | Methods and apparatus for depositing copper on tungsten | Sesha Varadarajan, Ugur Emekli | 2013-02-19 |
| 8308931 | Method and apparatus for electroplating | Bryan L. Buckalew, Zhian He, Seyang Park, Seshasayee Varadarajan, Bryan Pennington +4 more | 2012-11-13 |
| 8268155 | Copper electroplating solutions with halides | Jian Zhou | 2012-09-18 |
| 8197662 | Deposit morphology of electroplated copper | Eric G. Webb, Yuichi Takada, Timothy M. Archer | 2012-06-12 |
| 8172992 | Wafer electroplating apparatus for reducing edge defects | Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Zhian He +4 more | 2012-05-08 |
| 8168540 | Methods and apparatus for depositing copper on tungsten | Sesha Varadarajan, Ugur Emekli | 2012-05-01 |
| 8147660 | Semiconductive counter electrode for electrolytic current distribution control | Steven T. Mayer | 2012-04-03 |
| 8128791 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, John Sukamto, Zhian He, Seshasayee Varadarajan, Steven T. Mayer | 2012-03-06 |
| 8076241 | Methods for multi-step copper plating on a continuous ruthenium film in recessed features | Frank M. Cerio, Jr., Shigeru Mizuno, Thomas A. Ponnuswamy | 2011-12-13 |
| 8048280 | Process for electroplating metals into microscopic recessed features | Steven T. Mayer, Vijay Bhaskaran, Evan E. Patton, Robert Jackson | 2011-11-01 |
| 8043967 | Process for through silicon via filling | Katie Qun Wang, Mark J. Wiley | 2011-10-25 |