Issued Patents All Time
Showing 76–100 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Steven T. Mayer, Evan E. Patton, Brian Paul Blackman, Thomas A. Ponnuswamy, Harold D. Perry | 2004-08-10 |
| 6755946 | Clamshell apparatus with dynamic uniformity control | Evan E. Patton, Jeffrey A. Hawkins, Dinesh S. Kalakkad, Steven T. Mayer | 2004-06-29 |
| 6716334 | Electroplating process chamber and method with pre-wetting and rinsing capability | Steven W. Taatjes, Robert J. Contolini, Evan E. Patton | 2004-04-06 |
| 6664122 | Electroless copper deposition method for preparing copper seed layers | Tatyana N. Andryuschenko, Steven T. Mayer, Eric G. Webb | 2003-12-16 |
| 6653226 | Method for electrochemical planarization of metal surfaces | — | 2003-11-25 |
| 6569299 | Membrane partition system for plating of wafers | Robert J. Contolini, John O. Dukovic | 2003-05-27 |
| 6562204 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Robert J. Contolini | 2003-05-13 |
| 6554914 | Passivation of copper in dual damascene metalization | Robert T. Rozbicki, Ronald A. Powell, Erich R. Klawuhn, Michal Danek, Karl B. Levy +2 more | 2003-04-29 |
| 6551483 | Method for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Robert J. Contolini | 2003-04-22 |
| 6551487 | Methods and apparatus for controlled-angle wafer immersion | Steven T. Mayer, Seshasayee Varadarajan, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +1 more | 2003-04-22 |
| 6527920 | Copper electroplating apparatus | Steven T. Mayer, Evan E. Patton, Robert Jackson | 2003-03-04 |
| 6471845 | Method of controlling chemical bath composition in a manufacturing environment | John O. Dukovic, William E. Corbin, Jr., Erick G. Walton, Peter S. Locke, Panayotis Andricacos +2 more | 2002-10-29 |
| 6458262 | Electroplating chemistry on-line monitoring and control system | — | 2002-10-01 |
| 6284121 | Electroplating system including additive for filling sub-micron features | — | 2001-09-04 |
| 6214193 | Electroplating process including pre-wetting and rinsing | Steven W. Taatjes, Robert J. Contolini, Evan E. Patton | 2001-04-10 |
| 6193859 | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating | Robert J. Contolini, Evan E. Patton, Jingbin Feng, Steve Taatjes, John O. Dukovic | 2001-02-27 |
| 6179983 | Method and apparatus for treating surface including virtual anode | Steve Taatjes | 2001-01-30 |
| 6162344 | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer | Robert J. Contolini, Edward C. Opocensky, Evan E. Patton, Eliot K. Broadbent | 2000-12-19 |
| 6159354 | Electric potential shaping method for electroplating | Robert J. Contolini, Evan E. Patton, Jingbin Feng, Steve Taatjes, John O. Dukovic | 2000-12-12 |
| 6126798 | Electroplating anode including membrane partition system and method of preventing passivation of same | Robert J. Contolini, John O. Dukovic | 2000-10-03 |
| 6110346 | Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer | Robert J. Contolini, Edward C. Opocensky, Evan E. Patton, Eliot K. Broadbent | 2000-08-29 |
| 6099702 | Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability | Steven W. Taatjes, Robert J. Contolini, Evan E. Patton | 2000-08-08 |
| 6074544 | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer | Robert J. Contolini, Edward C. Opocensky, Evan E. Patton, Eliot K. Broadbent | 2000-06-13 |
| 6024857 | Electroplating additive for filling sub-micron features | — | 2000-02-15 |
| 5766499 | Method of making a circuitized substrate | Kim J. Blackwell, Daniel P. Labzentis | 1998-06-16 |