Issued Patents All Time
Showing 101–106 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5731547 | Circuitized substrate with material containment means and method of making same | Mark Daniel Derwin, Daniel P. Labzentis, Timothy Lee Sharp | 1998-03-24 |
| 5421507 | Au-Sn transient liquid bonding in high performance laminates | Charles R. Davis, Richard Hsiao, James R. Loomis, Jae Man Park | 1995-06-06 |
| 5280414 | Au-Sn transient liquid bonding in high performance laminates | Charles R. Davis, Richard Hsiao, James R. Loomis, Jae Man Park | 1994-01-18 |
| 5153986 | Method for fabricating metal core layers for a multi-layer circuit board | John M. Brauer, Frederick R. Christie, William H. Lawrence, Ashit A. Mehta, William J. Summa | 1992-10-13 |
| 4969979 | Direct electroplating of through holes | Bernd Karl Appelt, Perminder S. Bindra, Robert D. Edwards, James R. Loomis, Jae Man Park +2 more | 1990-11-13 |
| 4904350 | Submersible contact cell-electroplating films | Eugene P. Skarvinko, Arthur G. Starks | 1990-02-27 |