Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5668059 | Solder interconnection structure and process for making | Kostas Papathomas, David W. Wang | 1997-09-16 |
| 5471096 | Solder interconnection from a composition containing a mixture of dicyanates | Kostas Papathomas, David W. Wang | 1995-11-28 |
| 5250848 | Solder interconnection structure | Kostas Papathomas, David W. Wang | 1993-10-05 |
| 5194930 | Dielectric composition and solder interconnection structure for its use | Kostas Papathomas, Mark D. Poliks, David W. Wang | 1993-03-16 |
| 5153986 | Method for fabricating metal core layers for a multi-layer circuit board | John M. Brauer, William H. Lawrence, Ashit A. Mehta, Jonathan D. Reid, William J. Summa | 1992-10-13 |
| 5089440 | Solder interconnection structure and process for making | Kostas Papathomas, David W. Wang | 1992-02-18 |
| 4999699 | Solder interconnection structure and process for making | Kostas Papathomas, David W. Wang | 1991-03-12 |
| 4456712 | Bismaleimide triazine composition | Lawrence R. Daley | 1984-06-26 |