Issued Patents All Time
Showing 51–75 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043967 | Process for through silicon via filling | Katie Qun Wang, Mark J. Wiley | 2011-10-25 |
| 7967969 | Method of electroplating using a high resistance ionic current source | Steven T. Mayer | 2011-06-28 |
| 7964506 | Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers | Thomas A. Ponnuswamy, John Sukamto, Steve Mayer | 2011-06-21 |
| 7897198 | Electroless layer plating process and apparatus | Heung Lak Park, Eric G. Webb, Timothy Cleary | 2011-03-01 |
| 7854828 | Method and apparatus for electroplating including remotely positioned second cathode | Seshasayee Varadarajan, Bryan L. Buckalew, Patrick Breiling, Glenn Ibarreta | 2010-12-21 |
| 7811925 | Capping before barrier-removal IC fabrication method | Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2010-10-12 |
| 7799684 | Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers | Seyang Park, Seshasayee Varadarajan, Natalia V. Doubina | 2010-09-21 |
| 7776741 | Process for through silicon via filing | Katie Qun Wang, Mark J. Willey | 2010-08-17 |
| 7727863 | Sonic irradiation during wafer immersion | Bryan L. Buckalew, Johanes H. Sukamto, Frederick Dean Wilmot, Richard S. Hill | 2010-06-01 |
| 7686927 | Methods and apparatus for controlled-angle wafer positioning | Steven T. Mayer, Seshasayee Varadarajan, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +2 more | 2010-03-30 |
| 7622024 | High resistance ionic current source | Steven T. Mayer | 2009-11-24 |
| 7605082 | Capping before barrier-removal IC fabrication method | Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2009-10-20 |
| 7449098 | Method for planar electroplating | Steven T. Mayer, Mark L. Rea, Ismail Emesh, Henner Meinhold, John Drewery | 2008-11-11 |
| 7442267 | Anneal of ruthenium seed layer to improve copper plating | Eric G. Webb, Seyang Park, Johanes H. Sukamto | 2008-10-28 |
| 7341946 | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece | Sridhar Karthik Kailasam, John Drewery, Eric G. Webb, Johanes H. Sukamto | 2008-03-11 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction | Eric G. Webb, John Sukamto, Yuichi Takada | 2007-06-19 |
| 7211175 | Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Robert J. Contolini | 2007-05-01 |
| 7097410 | Methods and apparatus for controlled-angle wafer positioning | Steven T. Mayer, Seshasayee Varadarajan, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +2 more | 2006-08-29 |
| 7033465 | Clamshell apparatus with crystal shielding and in-situ rinse-dry | Evan E. Patton, Jeffrey A. Hawkins, Dinesh S. Kalakkad | 2006-04-25 |
| 6946065 | Process for electroplating metal into microscopic recessed features | Steven T. Mayer, Vijay Bhaskaran, Evan E. Patton, Robert Jackson | 2005-09-20 |
| 6890416 | Copper electroplating method and apparatus | Steven T. Mayer, Evan E. Patton, Robert Jackson | 2005-05-10 |
| 6884335 | Electroplating using DC current interruption and variable rotation rate | Eric G. Webb, John Sukamto, Sesha Varadarajan, Margolita M. Pollack, Bryan L. Buckalew +1 more | 2005-04-26 |
| 6821407 | Anode and anode chamber for copper electroplating | Timothy M. Archer, Thomas Tan Vu, Seshasayee Varadarajan, Jon Henri, Steven T. Mayer +3 more | 2004-11-23 |
| 6800187 | Clamshell apparatus for electrochemically treating wafers | Steven T. Mayer, R. Marshall Stowell, Evan E. Patton, Jeff Hawkins | 2004-10-05 |
| 6793796 | Electroplating process for avoiding defects in metal features of integrated circuit devices | David Craig Smith, Steven T. Mayer, Jon Henri, Sesha Varadarajan | 2004-09-21 |