Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11118278 | Enhanced plating bath and additive chemistries for cobalt plating | Roey Shaviv, Chris Pabelico | 2021-09-14 |
| 11024537 | Methods and apparatus for hybrid feature metallization | Roey Shaviv, Xikun Wang | 2021-06-01 |
| 10950500 | Methods and apparatus for filling a feature disposed in a substrate | Roey Shaviv, Xikun Wang, Jianxin Lei, Wenting Hou | 2021-03-16 |
| 10665503 | Semiconductor reflow processing for feature fill | — | 2020-05-26 |
| 10636655 | Methods for asymmetric deposition of metal on high aspect ratio nanostructures | Ben-Li Sheu, Bencherki Mebarki, Joung Joo Lee, Roey Shaviv, Xianmin Tang | 2020-04-28 |
| 10622252 | Co or Ni and Cu integration for small and large features in integrated circuits | Roey Shaviv | 2020-04-14 |
| 10487410 | Enhanced plating bath and additive chemistries for cobalt plating | Roey Shaviv, Chris Pabelico | 2019-11-26 |
| 10062607 | Methods for producing interconnects in semiconductor devices | Roey Shaviv, Mehul Naik | 2018-08-28 |
| 9840788 | Method for electrochemically depositing metal on a reactive metal film | Roey Shaviv, Dimitrios Argyris, Serdar Aksu | 2017-12-12 |
| 9828687 | Method for electrochemically depositing metal on a reactive metal film | Roey Shaviv, Dimitrios Argyris, Serdar Aksu | 2017-11-28 |
| 9805976 | Co or Ni and Cu integration for small and large features in integrated circuits | Roey Shaviv | 2017-10-31 |
| 9768060 | Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD | Roey Shaviv | 2017-09-19 |
| 9704717 | Electrochemical plating methods | John W. Lam, Roey Shaviv | 2017-07-11 |
| 9496145 | Electrochemical plating methods | John W. Lam, Roey Shaviv | 2016-11-15 |
| 9425092 | Methods for producing interconnects in semiconductor devices | Roey Shaviv, Mehul Naik | 2016-08-23 |
| 9245798 | Semiconductor reflow processing for high aspect ratio fill | Robert C. Linke | 2016-01-26 |
| 8357599 | Seed layer passivation | Callie A. Schieffer | 2013-01-22 |
| 8268135 | Method and apparatus for electrochemical planarization of a workpiece | Saket Chadda, Nikolay Korovin, Brian L. Mueller | 2012-09-18 |
| 7625814 | Filling deep features with conductors in semiconductor manufacturing | Chantal Arena, Bulent M. Basol | 2009-12-01 |
| 7449098 | Method for planar electroplating | Steven T. Mayer, Jonathan D. Reid, Mark L. Rea, Henner Meinhold, John Drewery | 2008-11-11 |
| 7297239 | Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface | Periya Gopalan, Phillip M. Rayer, II, Bentley J. Palmer | 2007-11-20 |
| 7201828 | Planar plating apparatus | — | 2007-04-10 |
| 7033464 | Apparatus for electrochemically depositing a material onto a workpiece surface | Saket Chadda | 2006-04-25 |
| 6974525 | Method and apparatus for electrochemical planarization of a workpiece | Saket Chadda, Nikolay Korovin, Brian L. Mueller | 2005-12-13 |
| 6849547 | Apparatus and process for polishing a workpiece | Saket Chadda, Brian L. Mueller | 2005-02-01 |