| 11118278 |
Enhanced plating bath and additive chemistries for cobalt plating |
Roey Shaviv, Chris Pabelico |
2021-09-14 |
$84,054,000 |
| 11024537 |
Methods and apparatus for hybrid feature metallization |
Roey Shaviv, Xikun Wang |
2021-06-01 |
$74,932,000 |
| 10950500 |
Methods and apparatus for filling a feature disposed in a substrate |
Roey Shaviv, Xikun Wang, Jianxin Lei, Wenting Hou |
2021-03-16 |
$56,717,000 |
| 10665503 |
Semiconductor reflow processing for feature fill |
— |
2020-05-26 |
$28,096,000 |
| 10636655 |
Methods for asymmetric deposition of metal on high aspect ratio nanostructures |
Ben-Li Sheu, Bencherki Mebarki, Joung Joo Lee, Roey Shaviv, Xianmin Tang |
2020-04-28 |
$15,875,000 |
| 10622252 |
Co or Ni and Cu integration for small and large features in integrated circuits |
Roey Shaviv |
2020-04-14 |
$32,620,000 |
| 10487410 |
Enhanced plating bath and additive chemistries for cobalt plating |
Roey Shaviv, Chris Pabelico |
2019-11-26 |
$24,423,000 |
| 10062607 |
Methods for producing interconnects in semiconductor devices |
Roey Shaviv, Mehul Naik |
2018-08-28 |
$23,630,000 |
| 9840788 |
Method for electrochemically depositing metal on a reactive metal film |
Roey Shaviv, Dimitrios Argyris, Serdar Aksu |
2017-12-12 |
$38,022,000 |
| 9828687 |
Method for electrochemically depositing metal on a reactive metal film |
Roey Shaviv, Dimitrios Argyris, Serdar Aksu |
2017-11-28 |
$20,834,000 |
| 9805976 |
Co or Ni and Cu integration for small and large features in integrated circuits |
Roey Shaviv |
2017-10-31 |
$27,276,000 |
| 9768060 |
Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD |
Roey Shaviv |
2017-09-19 |
$15,798,000 |
| 9704717 |
Electrochemical plating methods |
John W. Lam, Roey Shaviv |
2017-07-11 |
$41,590,000 |
| 9496145 |
Electrochemical plating methods |
John W. Lam, Roey Shaviv |
2016-11-15 |
$32,851,000 |
| 9425092 |
Methods for producing interconnects in semiconductor devices |
Roey Shaviv, Mehul Naik |
2016-08-23 |
$27,323,000 |
| 9245798 |
Semiconductor reflow processing for high aspect ratio fill |
Robert C. Linke |
2016-01-26 |
$7,094,000 |
| 8357599 |
Seed layer passivation |
Callie A. Schieffer |
2013-01-22 |
$11,793,000 |
| 8268135 |
Method and apparatus for electrochemical planarization of a workpiece |
Saket Chadda, Nikolay Korovin, Brian L. Mueller |
2012-09-18 |
|
| 7625814 |
Filling deep features with conductors in semiconductor manufacturing |
Chantal Arena, Bulent M. Basol |
2009-12-01 |
|
| 7449098 |
Method for planar electroplating |
Steven T. Mayer, Jonathan D. Reid, Mark L. Rea, Henner Meinhold, John Drewery |
2008-11-11 |
$5,105,000 |
| 7297239 |
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface |
Periya Gopalan, Phillip M. Rayer, II, Bentley J. Palmer |
2007-11-20 |
$10,840,000 |
| 7201828 |
Planar plating apparatus |
— |
2007-04-10 |
$7,384,000 |
| 7033464 |
Apparatus for electrochemically depositing a material onto a workpiece surface |
Saket Chadda |
2006-04-25 |
|
| 6974525 |
Method and apparatus for electrochemical planarization of a workpiece |
Saket Chadda, Nikolay Korovin, Brian L. Mueller |
2005-12-13 |
|
| 6849547 |
Apparatus and process for polishing a workpiece |
Saket Chadda, Brian L. Mueller |
2005-02-01 |
|
