Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Filling deep features with conductors in semiconductor manufacturing

Filling deep features with conductors in semiconductor manufacturing

US Patent 7625814 · Granted Dec 1, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and tools for electrical property depth profiling using electro-etching2025
Engineered substrates, free-standing semiconductor microstructures, and related 2024
Methods and apparatus for test pattern forming and film property measurement2023
Methods and apparatus for test pattern forming and film property measurement2022
Enhanced plating bath and additive chemistries for cobalt plating2021
Methods and apparatus for hybrid feature metallization2021
Methods and apparatus for filling a feature disposed in a substrate2021
Methods and systems for material property profiling of thin films2020
Semiconductor reflow processing for feature fill2020
Methods for asymmetric deposition of metal on high aspect ratio nanostructures2020
Co or Ni and Cu integration for small and large features in integrated circuits2020
Enhanced plating bath and additive chemistries for cobalt plating2019