Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394608 | Cleaning system for removing deposits from pump in an exhaust of a substrate processing system | Krishna Birru, Gang Liu, Leonard Wai Fung Kho, Gishun Hsu | 2025-08-19 |
| 12387979 | Tungsten feature fill with nucleation inhibition | Tsung-Han Yang, Jasmine Lin | 2025-08-12 |
| 12261081 | Tungsten feature fill with inhibition control | Tsung-Han Yang, Michael J. Bowes, Gang Liu | 2025-03-25 |
| 12227837 | Ex situ coating of chamber components for semiconductor processing | Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more | 2025-02-18 |
| 12173399 | Reducing line bending during metal fill process | Lei Guo, Tsung-Han Yang | 2024-12-24 |
| 12163219 | Ex situ coating of chamber components for semiconductor processing | Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more | 2024-12-10 |
| 12002679 | High step coverage tungsten deposition | Michael J. Bowes, Tsung-Han Yang, Xing Zhang | 2024-06-04 |
| 11978666 | Void free low stress fill | Tsung-Han Yang | 2024-05-07 |
| 11901227 | Feature fill with nucleation inhibition | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2024-02-13 |
| 11437269 | Tungsten feature fill with nucleation inhibition | Tsung-Han Yang, Jasmine Lin | 2022-09-06 |
| 11410883 | Tungsten feature fill with nucleation inhibition | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2022-08-09 |
| 11365479 | Ex situ coating of chamber components for semiconductor processing | Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more | 2022-06-21 |
| 11075115 | Tungsten feature fill | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2021-07-27 |
| 11069535 | Atomic layer etch of tungsten for enhanced tungsten deposition fill | Chiukin Steven Lai, Keren Jacobs Kanarik, Samantha Tan, Teh-Tien Su, Wenbing Yang +2 more | 2021-07-20 |
| 10977405 | Fill process optimization using feature scale modeling | Michael J. Bowes, Atashi Basu, Kapil Sawlani, Dongyao Li, David M. Fried +1 more | 2021-04-13 |
| 10916434 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Raashina Humayun, Michal Danek | 2021-02-09 |
| 10760158 | Ex situ coating of chamber components for semiconductor processing | Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more | 2020-09-01 |
| 10580695 | Feature fill with nucleation inhibition | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2020-03-03 |
| 10580654 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Raashina Humayun, Michal Danek | 2020-03-03 |
| 10566211 | Continuous and pulsed RF plasma for etching metals | Madhu Santosh Kumar Mutyala | 2020-02-18 |
| 10395944 | Pulsing RF power in etch process to enhance tungsten gapfill performance | Waikit Fung, Liang Meng | 2019-08-27 |
| 10381266 | Tungsten feature fill with nucleation inhibition | Tsung-Han Yang, Jasmine Lin | 2019-08-13 |
| 10256142 | Tungsten feature fill with nucleation inhibition | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2019-04-09 |
| 10211099 | Chamber conditioning for remote plasma process | Deqi Wang, Gang Liu, Tsung-Han Yang, John W. Griswold | 2019-02-19 |
| 10199267 | Tungsten nitride barrier layer deposition | Rohit Khare, Jasmine Lin | 2019-02-05 |