| 12476143 |
Backside reactive inhibition gas |
Gangcheng Liu, Tsung-Han Yang, Michael J. Bowes, Leonard Wai Fung Kho, Eric H. Lenz |
2025-11-18 |
|
| 12448686 |
Reducing line bending during metal fill process |
Lei Guo, Gangcheng Liu, Sanjay Gopinath |
2025-10-21 |
|
| 12444651 |
Tungsten feature fill with nucleation inhibition |
Esther Jeng, Raashina Humayun, Michal Danek, Justin Z. Gao, Dele Wang |
2025-10-14 |
|
| 12394608 |
Cleaning system for removing deposits from pump in an exhaust of a substrate processing system |
Krishna Birru, Gang Liu, Leonard Wai Fung Kho, Gishun Hsu |
2025-08-19 |
|
| 12387979 |
Tungsten feature fill with nucleation inhibition |
Tsung-Han Yang, Jasmine Lin |
2025-08-12 |
|
| 12261081 |
Tungsten feature fill with inhibition control |
Tsung-Han Yang, Michael J. Bowes, Gang Liu |
2025-03-25 |
|
| 12227837 |
Ex situ coating of chamber components for semiconductor processing |
Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more |
2025-02-18 |
|
| 12173399 |
Reducing line bending during metal fill process |
Lei Guo, Tsung-Han Yang |
2024-12-24 |
$409,049,000 |
| 12163219 |
Ex situ coating of chamber components for semiconductor processing |
Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more |
2024-12-10 |
$119,772,000 |
| 12002679 |
High step coverage tungsten deposition |
Michael J. Bowes, Tsung-Han Yang, Xing Zhang |
2024-06-04 |
$167,357,000 |
| 11978666 |
Void free low stress fill |
Tsung-Han Yang |
2024-05-07 |
$395,592,000 |
| 11901227 |
Feature fill with nucleation inhibition |
Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang |
2024-02-13 |
$429,866,000 |
| 11437269 |
Tungsten feature fill with nucleation inhibition |
Tsung-Han Yang, Jasmine Lin |
2022-09-06 |
|
| 11410883 |
Tungsten feature fill with nucleation inhibition |
Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang |
2022-08-09 |
|
| 11365479 |
Ex situ coating of chamber components for semiconductor processing |
Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more |
2022-06-21 |
$420,283,000 |
| 11075115 |
Tungsten feature fill |
Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang |
2021-07-27 |
|
| 11069535 |
Atomic layer etch of tungsten for enhanced tungsten deposition fill |
Chiukin Steven Lai, Keren Jacobs Kanarik, Samantha Tan, Teh-Tien Su, Wenbing Yang +2 more |
2021-07-20 |
$260,622,000 |
| 10977405 |
Fill process optimization using feature scale modeling |
Michael J. Bowes, Atashi Basu, Kapil Sawlani, Dongyao Li, David M. Fried +1 more |
2021-04-13 |
$221,486,000 |
| 10916434 |
Feature fill with multi-stage nucleation inhibition |
Deqi Wang, Raashina Humayun, Michal Danek |
2021-02-09 |
$279,311,000 |
| 10760158 |
Ex situ coating of chamber components for semiconductor processing |
Damodar Rajaram Shanbhag, Guangbi Yuan, Thadeous Bamford, Curtis Bailey, Tony Kaushal +11 more |
2020-09-01 |
$45,225,000 |
| 10580654 |
Feature fill with multi-stage nucleation inhibition |
Deqi Wang, Raashina Humayun, Michal Danek |
2020-03-03 |
$44,545,000 |
| 10580695 |
Feature fill with nucleation inhibition |
Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang |
2020-03-03 |
$44,545,000 |
| 10566211 |
Continuous and pulsed RF plasma for etching metals |
Madhu Santosh Kumar Mutyala |
2020-02-18 |
$39,150,000 |
| 10395944 |
Pulsing RF power in etch process to enhance tungsten gapfill performance |
Waikit Fung, Liang Meng |
2019-08-27 |
$43,634,000 |
| 10381266 |
Tungsten feature fill with nucleation inhibition |
Tsung-Han Yang, Jasmine Lin |
2019-08-13 |
|
